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Home > Product > Xilinx, Inc > Virtex-7 FPGAs
XC7VX485T-3FF1927E

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XC7VX485T-3FF1927E

Manufacturer:
Xilinx
Package/Case:
1924-BBGA, FCBGA
RoHS:
Lifecycle:
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7VX485T-3FF1927E
Product Categories:
Embedded - FPGAs (Field Programmable Gate Array)
Description:
Virtex-7 FPGA 600 I/O 1927FCBGA 37969920 485760 Cells
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XC7VX485T-3FF1927E Overview

This AMD Xilinx XC7VX485T-3FF1927E belongs to the category of Field Programmable Gate Arrays (FPGAs). The XC7VX485T-3FF1927E FPGAs from Xilinx cover the full spectrum of system needs, from low cost, small form factor, cost-sensitive, high volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing ability for the high reliability needs beyond commercial applications. This device offers a fully programmable alternative to ASSPs and ASICs. They are built on a cutting-edge, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology. They enable an unprecedented increase in system performance with 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP. Virtex-7, MMCM, PLL, 600 I/Os, 741 MHz, 693120 Cells, 970 mV to 1.03 V, FCBGA-1927 are all features of the Xilinx FPGAs (Field Programmable Gate Array) series XC7VX485T-3FF1927E. View Substitutes & Alternatives, datasheets, stock, pricing from Vemeko, as well as other FPGAs goods, at www.vemeko.com.


XC7VX485T-3FF1927E Features

  • High-speed serial communication with integrated multi-gigabit transceivers, providing a dedicated low-power mode that is suited for chip-to-chip interfaces, with maximum speeds ranging from 600 Mb/s to 6.6 Gb/s up to 28.05 Gb/s. 

  • A user-configurable analog interface (XADC) with dual 12-bit 1MSPS analog-to-digital converters with supply and heat sensors built right into the chip. 

  • DSP slices with an optimized symmetric coefficient filter and a 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering.

  • Phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks are combined in powerful clock management tiles (CMT) for high precision and low jitter. 

  • Utilize the MicroBlazeTM processor to quickly install embedded processing. 

  • PCI Express® (PCIe) integrated block supports up to x8 Gen3 Endpoint and Root Port designs. 

  • Numerous configuration options, including HMAC/SHA-256 authentication, built-in SEU detection and correction, and support for common memory types. 

  • Flip-chip packaging that is low-cost, wire-bonded, bare-die, and high signal integrity and allows for simple family migration in the same package. Both Pb-free versions of all packages and Pb versions of some packages are offered.


XC7VX485T-3FF1927E Applications

  • Sensor fusion

  • Embedded vision

  • Software defined radio

  • Programmable logic controller

  • Machine vision camera

  • Portable ultrasound

  • ADAS

  • Medical Endoscope


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7VX485T-3FF1927E Specifications

SpecificationValue
Number of LABs/CLBs37950
Number of Logic Elements/Cells485760
Total RAM Bits37969920
Number of I/O600
Voltage - Supply0.97V ~ 1.03V
Mounting TypeSurface Mount
Operating Temperature0℃ ~ 100℃ (TJ)
Package / Case1924-BBGA, FCBGA
Supplier Device Package1927-FCBGA (45x45)

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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