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Home > Product > Xilinx, Inc > Virtex-7 FPGAs
XC7VX690T-1FFG1761I

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XC7VX690T-1FFG1761I

Manufacturer:
Xilinx
Package/Case:
FCBGA-1760
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7VX690T-1FFG1761I
Product Categories:
Embedded - FPGAs (Field Programmable Gate Array)
Description:
FPGA Virtex-7 XT Family 693120 Cells 28nm Technology 1V 1760-Pin FCBGA Tray 54190080 850 I/O
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XC7VX690T-1FFG1761I Overview

A Field Programmable Gate Array XC7VX690T-1FFG1761I is an integrated circuit that falls under the AMD Xilinx brand. The XC7VX690T-1FFG1761I FPGAs from Xilinx cover the full spectrum of system needs, from low cost, small form factor, cost-sensitive, high volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing ability for the high reliability needs beyond commercial applications. This device offers a fully programmable alternative to ASSPs and ASICs. They are built on a cutting-edge, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology. They enable an unprecedented increase in system performance with 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP. Virtex-7, MMCM, PLL, 600 I/Os, 741 MHz, 693120 Cells, 970 mV to 1.03 V, FCBGA-1927 are all features of the Xilinx FPGAs (Field Programmable Gate Array) series XC7VX690T-1FFG1761I. View Substitutes & Alternatives, datasheets, stock, pricing from Vemeko, as well as other FPGAs goods, at www.vemeko.com.

 

XC7VX690T-1FFG1761I Features

  • A user-configurable analog interface (XADC) with dual 12-bit 1MSPS analog-to-digital converters with supply and heat sensors built right into the chip. 

  • DSP slices with an optimized symmetric coefficient filter and a 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering.

  • Phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks are combined in powerful clock management tiles (CMT) for high precision and low jitter. 

  • Utilize the MicroBlazeTM processor to quickly install embedded processing. 

  • PCI Express® (PCIe) integrated block supports up to x8 Gen3 Endpoint and Root Port designs. 

  • Numerous configuration options, including HMAC/SHA-256 authentication, built-in SEU detection and correction, and support for common memory types. 

  • Flip-chip packaging that is low-cost, wire-bonded, bare-die, and high signal integrity and allows for simple family migration in the same package. Both Pb-free versions of all packages and Pb versions of some packages are offered.

  • With 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power, it is designed for maximum performance and lowest power.

  • MicroBlaze™ processor: The MicroBlaze™ processor is a soft processor that can be used to quickly deploy embedded processing.


XC7VX690T-1FFG1761I Applications

  • Consumer electronics

  • Medical devices

  • Defense applications

  • The embedded OEM

  • Software defined radio

  • Any-to-any connectivity

  • Programmable logic controller


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7VX690T-1FFG1761I Specifications

SpecificationValue
Number of LABs/CLBs54150
Number of Logic Elements/Cells693120
Total RAM Bits54190080
Number of I/O850
Voltage - Supply0.97V ~ 1.03V
Mounting TypeSurface Mount
Operating Temperature-40℃ ~ 100℃ (TJ)
Package / Case1760-BBGA, FCBGA
Supplier Device Package1761-FCBGA (42.5x42.5)

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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