XC7VX690T-2FF1930C
XC7VX690T-2FF1930C belongs to the FPGA (Field Programmable Gate Array) category and is an AMD Xilinx integrated circuit. The XC7VX690T-2FF1930C FPGAs from Xilinx cover the full spectrum of system needs, from low cost, small form factor, cost-sensitive, high volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing ability for the high reliability needs beyond commercial applications. This device offers a fully programmable alternative to ASSPs and ASICs. They are built on a cutting-edge, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology. They enable an unprecedented increase in system performance with 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP. Virtex-7, MMCM, PLL, 600 I/Os, 741 MHz, 693120 Cells, 970 mV to 1.03 V, FCBGA-1927 are all features of the Xilinx FPGAs (Field Programmable Gate Array) series XC7VX690T-2FF1930C. View Substitutes & Alternatives, datasheets, stock, pricing from Authorized Distributors, as well as other FPGAs goods, at www.vemeko.com.
36 Kb dual-port block RAM: The 36 Kb dual-port block RAM has integrated FIFO circuitry for on-chip data buffering.
High-performance SelectIO™ technology: The high-performance SelectIO™ technology supports DDR3 interfaces up to 1,866 Mb/s.
Integrated PCI Express® (PCIe) block: The integrated PCI Express® (PCIe) block supports up to x8 Gen3 Endpoint and Root Port designs.
Powerful clock management tiles (CMT): The powerful clock management tiles (CMT) integrate mixed-mode clock manager (MMCM) and phase-locked loop (PLL) blocks for high precision and minimal jitter.
Dual 12-bit 1MSPS analog-to-digital converters: The dual 12-bit 1MSPS analog-to-digital converters with on-chip supply and heat sensors make up the user-configurable analog interface (XADC).
Built on low-power (HPL), 28nm, high-k metal gate (HKMG) process technology
Up to 2M logic cells, VCXO component, AXI IP, and AMS integration
Up to 2.8TB/s total serial bandwidth with up to 96 x 13.1G GTs, up to 16 x 28.05G GTs, 5,335 GMACs, 68Mb BRAM, DDR3-1866
Automated manufacturing
Portable ultrasound
Industrial control
Sensor fusion
Vehicles and transportation
Embedded vision
Consumer electronics
Medical devices
Defense applications
| Specification | Value |
|---|---|
| Logic Cells | 693,120 |
| DSP Slices | 3,600 |
| Memory (Kb) | 52,920 |
| GTX 12.5Gb/s Transceivers | - |
| GTH 13.1Gb/s Transceivers | 80 |
| I/O Pins | 1,000 |
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