Using both monolithic and the most recent stacked silicon interface (SSI) technology, XCKU115-2FLVD1517E is high-performance FPGA with a focus on price/performance. An ideal balance of capability and affordability is made possible by next-generation transceivers, high DSP and block RAM-to-logic ratios, and affordable packaging.
With the largest signal processing bandwidth in a mid-range device, next-generation transceivers, and affordable packaging, XCKU115-2FLVD1517E offers the best price/performance/watt at 20nm for an ideal balance of capabilities and cost-effectiveness. XCKU115-2FLVD1517E is perfect for DSP-intensive processing required in next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure, as well as packet processing in 100G networking and data center applications.
| Specification | Value |
|---|---|
| Number of LABs/CLBs | 82920 |
| Number of Logic Elements/Cells | 1451100 |
| Total RAM Bits | 77721600 |
| Number of I/O | 338 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0℃ ~ 100℃ (TJ) |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40) |
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